Packaging Machinery & Equipment Events in Japan

FOOMA JAPAN

FOOMA JAPAN is recognized as one of the world's largest comprehensive trade shows for food manufacturing. It features production and processing technologies, as well as freezing and cooling equipment, foreign matter detection and removal systems, and waste treatment solutions.

The event is held at Tokyo Big Sight, Japan’s largest exhibition hall, spanning over 60,000 square meters. The exhibition space accommodates a wide range of food processing machines and technologies. FOOMA JAPAN attracts nearly 1,000 exhibitors and over 100,000 visitors annually, positioning it among the major global trade shows.

The theme for 2025, "Touch FOOMA, Taste the Future," emphasizes progress in food processing technology. One of the highlights is the Start-Up Zone which will feature 30 companies, including 12 new participants, presenting daily pitch events and innovations in AI and robotics related to food processing.

In addition, the FOOMA Awards, now in its fourth year, recognize advancements in food machinery research and development. A notable past award-winning innovation was a pasta dispenser that automated container placement, noodle separation, weighing, and plating, reducing labor costs. The 2025 awards will continue to highlight innovations with potential applications in food manufacturing and restaurant operations.

FOOMA JAPAN 2025 provides an opportunity to interact with Japanese food machinery firsthand. Visitors can assess equipment suitability for factory operations and compliance with safety standards.

Exhibits will include advanced food processing equipment, such as sashimi slicers with laser sensors for safety, meat slicers for precise cuts, and vacuum fryers for reduced oil content. These technologies demonstrate both innovation and practicality for food processing businesses.

The event implements an advanced visitor management system to facilitate access for international attendees.

Pre-event exhibitor information is available, and onsite ID readers streamline information exchange, reducing the need for business cards. The "GLOBAL INFORMATION" booth offers tailored exhibitor and equipment recommendations based on visitor inquiries.

For more details about FOOMA JAPAN, visit the official website.

IC & SENSOR PACKAGING EXPO

The ISP EXPO is a premier event that brings together professionals and innovators in the field of integrated circuit (IC) final assembly and packaging. The expo provides an essential platform for participants to explore the latest advancements in equipment, materials, and services specifically designed to meet the evolving needs of the IC packaging industry. The event is particularly valuable for businesses looking to stay competitive in an increasingly complex technological landscape, offering direct access to the cutting-edge tools and solutions that are transforming the industry.

One of the key attractions of the ISP EXPO is its ability to showcase a wide array of technologies from some of the most prominent players in the field. From state-of-the-art equipment for assembly and packaging processes to the latest materials designed for more efficient, sustainable, and cost-effective solutions, the event highlights the diversity of offerings available to professionals. The expo’s comprehensive nature ensures that visitors can find solutions for various stages of the IC packaging process, including testing, inspection, and handling, making it an indispensable resource for companies looking to streamline their operations and improve product quality.

A standout aspect of the ISP EXPO is its integration with NEPCON Japan, one of the largest electronics trade fairs in Asia. This collaboration broadens the scope of the event and enhances its value for participants. While the ISP EXPO focuses on IC assembly and packaging, NEPCON Japan covers a wide range of electronics manufacturing technologies, offering attendees the opportunity to explore synergies between the IC packaging sector and other areas of the electronics industry. This integration allows for deeper collaboration and knowledge sharing, creating a more holistic experience for anyone in the electronics manufacturing value chain.

Held at Tokyo Big Sight, a renowned exhibition center in Tokyo, the ISP EXPO benefits from its location in one of the world's most important hubs for technology and innovation. Tokyo Big Sight is known for its world-class facilities, making it an ideal venue for such a high-profile event. Its modern infrastructure and accessibility ensure that attendees, from all corners of the globe, can have a seamless experience while engaging with exhibitors, attending conferences, and networking with peers.

The ISP EXPO attracts a professional audience, including key decision-makers, engineers, and business leaders, all eager to stay ahead of the curve in a fast-moving industry. The event provides numerous opportunities for networking, partnerships, and collaboration, allowing attendees to forge lasting business relationships with suppliers, manufacturers, and technology providers. With its focus on fostering innovation and driving business growth, the ISP EXPO is a must-attend event for professionals involved in IC packaging and the broader electronics manufacturing sector. Whether you're looking to discover new products, learn from industry leaders, or expand your network, this expo offers everything you need to succeed in a highly competitive market.

TOKYO PACK

Tokyo Pack stands as Asia's largest and most significant packaging exhibition, offering a comprehensive exploration of the entire packaging spectrum. This prestigious event, with a history spanning 52 years, has earned its reputation as a leading global packaging showcase. Tokyo Pack brings together every aspect of the packaging industry, encompassing distribution, sales, consumption, and recycling.

The exhibition serves as a crucial platform for both exhibitors and visitors, providing an unparalleled experience in the world of packaging. It offers a dynamic space where industry professionals can delve into the latest innovations and trends shaping the future of packaging. Tokyo Pack not only highlights cutting-edge technologies and solutions but also fosters valuable connections and exchanges within the packaging community.

With its extensive history and continued prominence, Tokyo Pack remains a pivotal event for those involved in the packaging industry, reflecting the latest advancements and driving future developments in the field.