EVM ASIA
November 18, 2024 - November 20, 2024
Completed Malaysia is set to make a significant mark in the automotive world by hosting the region's inaugural international exhibition dedicated exclusively to the manufacturing of electric, hybrid, and autonomous vehicles. The EVM ASIA exhibition will take place at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, offering a premier platform for showcasing cutting-edge advancements in the field.
This landmark event provides an exceptional opportunity for suppliers of machinery, equipment, parts, and components, as well as those involved in software, systems, applications, and e-mobility solutions, to present their innovations. As automotive manufacturers rapidly adapt their facilities to accommodate electric and hybrid vehicles, EVM ASIA serves as a crucial venue for unveiling the future of mobility technology.
EVM ASIA is poised to be a focal point for industry leaders and innovators to display their latest products and services. The exhibition will feature a broad array of technological advancements and solutions that are shaping the future of transportation. Attendees will have the chance to explore the latest developments in electric and hybrid vehicle technology, as well as autonomous driving systems.
The event represents a timely and pivotal moment for the automotive industry, providing a comprehensive overview of emerging technologies and trends in the realm of e-mobility. By bringing together key players from various sectors, EVM ASIA will facilitate valuable exchanges of ideas and foster new business opportunities, underscoring its role as a significant event in the global automotive calendar.
In essence, EVM ASIA at MITEC in Kuala Lumpur is not only a showcase of the latest innovations but also a vital platform for discussing and driving forward the advancements in electric, hybrid, and autonomous vehicle manufacturing. It stands as a testament to the region’s commitment to leading the way in the future of mobility technology.
